Engineering Building, Room 2120
428 S. Shaw Lane
East Lansing, MI 48824
John Papapolymerou’s research interests are in the areas of RF/microwave/mm-wave/THz circuits, antennas and packaging for wireless communication systems, sensors and radars. His current projects include the utilization of additive manufacturing techniques for three-dimensional RF circuits and modules, the development of cost effective packaged RF modules for high power applications, as well as the development of thin nanomagnetic materials for high frequency applications. He served as the Editor-in-Chief for IEEE Microwave and Wireless Components Letters from 2012-2015.